Huawei’s HiSilicon Kirin 985 chipset will be manufactured with 5G modem using Taiwan Semiconductor Manufacturing Company's (TSMC's) new 7nm fabrication process, and it will go into mass production from the third quarter of this year, a media report in CNMO.com has said. TSMC will use 7nm Extreme UltraViolet (EUV) process (called N7+), along with the Flip-Chip Package-on-Package (FC-PoP) process that allows vertical stacking of transistors. A combination of EUV (which increases the accuracy of transistor placement) and FC-PoP manufacturing processes means that the transistor density on the chip will be increased by 20 percent resulting in better performance and lower energy consumption. The news comes almost two weeks after a report in Chinese news outlet Commercial Times claimed the Kirin 985 chipset will enter into mass production in the second half of 2019. Further, it has been reported that Huawei will bring the HiSilicon Kirin 985 in the Mate 30 series of phones. The firs...